High Density

As the functionality of today’s electronic device becomes ever more complex, the electronic content inside the device is placing a greater demand on the circuit capacity of the interconnect system outside the device. Amphenol is meeting these challenges and leading the circular connector class by offering interconnect products like the Pulse-Lok® with up to 78 contact positions in a housing measuring 1.2” in diameter. At the board level, cStack™ connectors provide up to 127 lines per linear board inch (5 rows on 1 mm). Amphenol Alden is incorporating this high density contact technology in the New Pulse Lok HD series, which is launching in 2010.

High contact density is critical in reducing the size and weight of interconnects located at the human interface – front panels and hand held devices. Cable management issues are also addressed by adopting a connector that can accommodate the circuitry that traditionally required two or three interconnects. Amphenol’s high density contacts are designed specifically to yield a reliable normal force / low insertion combination. These attributes complement the intuitive user-friendly mating action of Amphenol’s connector making it a popular choice for:

• Patient monitoring

• Electronic catheters

• Portable Ultrasound devices

• Emergency Response Defibrillators and other Portable medical devices

Amphenol’s interconnect solutions begin at the connector but can include complete performance engineered cable assemblies and custom electronic subassemblies. These products are manufactured at our ISO certified locations. Advanced termination techniques are available that can reduce the cost and improve the reliability of your completed cable assembly.